tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 1 toshiba ingaa ? p led tlrme68cg(f),tlye68cg(f),tlge68cg(f),tlfge68cg(f) led lamps for mounting on through-hole pcb using an automatic insertion machine ? 3mm package wide viewing angle ? can be mounted on a pcb using an automatic insertion machine (please refer to mounting precauti ons using an automatic insertion machine) ? ingaa ? p ? emitted colors: red, yellow and green ? colored, transparent lens ? applications: various types of in formation panels, indicators for amusement equipment and panel backlighting illumination sources lineup product name color material tlrme68cg(f) red tlye68cg(f) yellow tlge68cg(f) green tlfge68cg(f) green pingaa l absolute maximum ratings (ta = 25c) product name forward current i f (ma) reverse voltage v r (v) power dissipation p d (mw) operating temperature t opr (c) storage temperature tstg (c) tlrme68cg(f) 50 4 120 tlye68cg(f) 50 4 120 tlge68cg(f) 50 4 120 tlfge68cg(f) 50 4 120 ?40~100 ?40~120 note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). unit: mm jedec D jeita D toshiba 4-3u1 weight: 0.15 g(typ.)
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 2 electrical and opti cal characteristics (ta = 25c) typ. emission wavelength luminous intensity i v forward voltage v f reverse current i r product name d p ? i f min typ. i f typ. max i f max v r tlrme68cg(f) 626 (636) 23 20 85 260 20 1.9 2.4 20 50 4 tlye68cg(f) 587 (590) 17 20 85 300 20 2.0 2.4 20 50 4 tlge68cg(f) 571 (574) 17 20 47.6 110 20 2.0 2.4 20 50 4 tlfge68cg(f) 565 (568) 15 20 27.2 70 20 2.0 2.4 20 50 4 unit nm ma mcd ma v ma a v precautions ? these led lamps made of p ingaa l will also emit some ir light. if a photodetector is located near an led lamp, please ensure that it will not be affected by this ir light. ? manual soldering should be performed within 3 s at a maximum temperature of 300c or 5 s at a maximum temperature of 260c. ? when forming the leads, bend each lead without appl ying any forming stress. soldering must be performed after the leads have been formed. mounting precautions using an automatic insertion machine (1) these newly designed led lamps are intended for mount ing on both through-hole pcbs by means of an automatic mounting machine. compared to conventional 3-mm led lamps, they are less prone to the effects of stress during automatic mounting (such as mechanical stress within the package resin transmitted via the leads). this reduced mechanical stress results in a lower incidence of damage to the package resin and lower emission failure rates. if one of thes e lamps is subjected to excessive stress, however, the resin part may break or the lamp may be damaged in such a way that it will not emit light. please take the following precauti ons when mounting these devices. ? toshiba recommends the use of a 0.9-mm pcb hole diam eter. however, this recommendation is subject to the type of automatic mounting machine used, the board material and the way in which the board material has been processed. plea se evaluate the mounting process ca refully before actually using the automatic mounting machine to mount these led lamps. the use of pcb holes with a diameter larger than 0.9 mm may result in increased stress when soldering is performed (depending on the lead cutting shape and the clinching me thod), and devices may easily be malfunction. ? the insertion pressure and clinching angle must both be minimized so as to minimize the lead-cutting stress and clinch stress applied to the led lamps. ? soldering conditions preheating soldering flow temperature 120~150c no more than 260c time within 60 seconds within 5 seconds (2) precautions when us ing panasert radial-taping automatic mounting machine: two-lead led lamps are suitable for mounting using an anvil due to its mo vable-blade structure. when using three-lead type, please take the following precautions. ? synchronize the strokes of the two movable blades to one another as closely as possible. ? adjust the timings of the movable blades so as to minimize the difference between them. in addition, do not set the anvil in such a way that the anvil?s center blade will pull the leads, as th is will result in excessive mechanical stress to the le d lamps, which might damage them. ? avoid any blade which is defective or which shows signs of excessive wear. * for using other than panasert, please refer to th e specifications for the automatic mounting machine which is to be used.
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 3 tlrme68cg(f) 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 1.6 50 30 10 3 1 5 100 ta = 25c 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 1 100 1000 100 ta = 25c 10 1 20 ? 20 80 0.1 3 1 0.3 0.5 0 40 60 5 10 700 0.8 0 0.6 1.0 0.2 0.4 i f = 20 ma ta = 25c 680 660 640 620 600 580 0 60 0 40 80 20 120 20 40 60 80 100 ambient temperature ta (c) i f ? ta allowable forward current i f (ma) radiation pattern ta = 25c relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength i f ? v f
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 4 tlye68cg(f) 1.6 50 30 10 3 1 5 100 ta = 25c 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 1 100 1000 100 ta = 25c 10 1 20 ? 20 80 0.1 3 1 0.3 0.5 0 40 60 660 0.8 0 0.6 1.0 0.2 0.4 i f = 20 ma ta = 25c 640 620 600 580 560 540 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0 60 0 40 80 20 120 20 40 60 80 100 ambient temperature ta (c) i f ? ta allowable forward current i f (ma) radiation pattern ta = 25c relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength i f ? v f
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 5 tlge68cg(f) 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0 60 0 40 80 20 120 20 40 60 80 100 1.6 50 30 10 3 1 5 100 ta = 25c 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 1 100 1000 100 ta = 25c 10 1 20 ? 20 80 0.1 3 1 0.3 0.5 0 40 60 5 10 640 0.8 0 0.6 1.0 0.2 0.4 i f = 20 ma ta = 25c 620 600 580 560 540 520 ambient temperature ta (c) i f ? ta allowable forward current i f (ma) radiation pattern ta = 25c relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength i f ? v f
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 6 tlfge68cg(f) 30 0 60 90 90 30 60 1.00.8 0.6 0.4 0.2 0 80 70 50 40 20 10 70 80 50 40 20 10 0 60 0 40 80 20 120 20 40 60 80 100 1.6 50 30 10 3 1 5 100 ta = 25c 1.7 1.8 1.9 2.0 2.1 2.2 2.3 10 1 100 1000 100 ta = 25c 10 1 20 ? 20 80 0.1 3 1 0.3 0.5 0 40 60 5 10 640 0.8 0 0.6 1.0 0.2 0.4 i f = 20 ma ta = 25c 620 600 580 560 540 520 ambient temperature ta (c) i f ? ta allowable forward current i f (ma) radiation pattern ta = 25c relative luminous intensity forward voltage v f (v) forward current i f (ma) forward current i f (ma) i v ? i f luminous intensity i v (mcd) case temperature tc (c) i v ? tc relative luminous intensity i v wavelength (nm) relative luminous intensity ? wavelength i f ? v f
tlrme68cg(f),tlye68cg(f),t lge68cg(f),tlfge68cg(f) 2007-10-01 7 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale fo r product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.
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